Breakable - 27 June 2010 11:10 PM
By “longer-term” I assume products that take longer to decay to background levels than a length of a single shot. I am sure there are such products, that means they are accumulating during run and I wonder what is the function describing their accumulation.
The rate of decay of potassium-40 naturally in the human body is ~4000 Bq. So, accumulation to above this level, during run, could only happen if medium-to-long-lived isotopes are generated faster than this.
We ignore short-lived isotopes, because cool-down for maintenance involves waiting for 13 hours, which is many times the half-life, so they will all be gone by the time we get near the device.
A 5MW reactor will generate ~20 kW worth of neutrons, broadly distributed in energy with upper bound ~2.9 MeV. It’s very much like the nuclear S-process in stars.. but happening at a very slow rate. So slow, in fact, that the chance of double-neutron absorption is very low, so only parent atoms deliberately part of the reactor assembly are involved.
The isotopes with > 1 day half-life are few; there is a threshold neutron energy for making them, yes. the neutron flux is low, yes; the parent atoms are not-necessarily in great abundance near the reactor, and this can be controlled by selecting reactor materials carefully. Note, also that decay modes for all these are mostly beta emitters.
So we can calculate the rate of production of radioisotopes, at a given distance from the plasmoid, from the neutron flux and the absorption cross-section of the parent.
In order by half-life, then:
Au-198 2.695 days; parent Au-197; maybe in nearby electronics
Sn-125 9.64 days; parent Sn-124 natural abundance 5.79%; in electronics
Os-191 15.4 days; parent Os-190 natural abundance; maybe in high T coatings
Fe-59 44.5 days; parent Fe-58 natural abundance 0.28%; maybe in structural material
W-185 75.1 days; parent W-184 natural abundance 30.64%; maybe in high T coatings
S-35 87.5 days; parent S-34 natural abundance 4.21%; in switch gases
Ta-182 114.3 days; parent Ta-181 natural abundance 99.9%; in nearby electronics
Sn-123 129.2 days; parent Sn-122, natural abundance 4.63%; in solder
Ag-110m 249.95 days; parent Ag-109, natural abundance 48.161%; in lead-free solder
Sn-121m 43.9 y; parent Sn-120, natural abundance 32.58%; in solder
Ni-63 100.1 y; parent Ni-62, natural abundance 3.634%; maybe in structural material
Ag-108m 418 y; parent Ag-107, natural abundance 51.839%; in lead-free solder
C-14 5,730 y; parent C-13, natural abundance 1.1%; in insulators
Cl-36 301 ky; parent Cl-35, natural abundance 75.77%; in PVC insulators
Be-10 1.5 My; parent Be-9, 100%; in the anode
Note that from an engineering perspective, the large majority of the above can be avoided entirely: by selecting materials, by avoiding placing complex electronics in the path of neutrons, and by avoiding using solder to join parts.
Edit:
Can someone please look up and post the absorption cross-section and activation threshold for the parent isotopes above, that will actually be exposed to neutrons?